Gennum操作说明书手册_Package_FA_report_from_DVTS

Validating Controlled ImpedanceDifferential PCB Lines on Gennum 1450C package Using"Comparative Analysis"FA Methodby Brian Shumaker DVT Solutions,LLC1011 Riverton Drive San Carlos.CA 94070 PH 650 593-7083.FAX 650 593-1236TDR Failure Analysis Testing ObjectiveGennum sent two GN1405 device packages to DVT Solutions,LLC to measure 6 differential lines on eachpackage (table 1)and each package was labeled "good"and "reject".The purpose for the measurements is toprovide a comparative impedance analysis of each package's respective differential impedances to reveal apotential Failure mode with one or more of the differential pairs.Each package had the die attached so theend of the transmission line cannot be defined.To TDR into the attached die will have an unpredictable resultas you may bias a component or circuitry on the die loosing the interconnect detail.Each of the 6 differentialsets were acquired and converted to an Impedance plot (Z-line)using the Tektronix IConnect software toincrease the accuracy of the TDR measurement by eliminating the multi path reflection errors.Eachdifferential sets from Table 1 were measured from the "good "and "reject"package and plotted together onseparate graphs for this Failure Analysis report.(Table 1)Differential I/O pins requiring TDR AnalysisPAIR NAMEPIN NAMEPIN#HR3+U22HR3 pairHR3-U21R2_1+AB7回R2_1 pair回R2_1-AA7R2_2+Y8R2_2 pairR2_2-W8通通通海y●●●●●GLOB TOPR2_3+AB9R2_3 pairR2_3-AA9●08意R2_4+AB10E●●●●R2_4 pair。。R2_4-AA108888.为567的市456节海药动夜O圈4网R2_CLK+Y6R2_CLK pairGennum GN1405 device packageR2_CLK-W6bottom side layout