使用高速印制板层压前铜面键合性能规范BondingPerformancespecificationofcoppersurfaceofhigh-speedprintedcircuitboardbeforelamination

ICS XX.XXX.XXCCS X XXXCSTM团体标准T/CSTM XXXXX-202X使用高速印制板层压前铜面键合性能规范Bonding Performance specification of copper surface of high-speed printedcircuit board before lamination(征求意见稿)CSTM202X-XX-XX发布202X-XxX-XX实施中关村材料试验技术联盟发布