FT-950_维修维护电器原理图手册

VERTEX STANDARD CO.,LTD.YAESU4-8-8 Nakameguro,Meguro-Ku,Tokyo 153-8644,JapanVERTEXSTANDARDUS Hea1090Waet CypressCA U..AFT-950YAESU EUROPE B.V.P.O.Box 75525,1118 ZN Schiphol,The NetherlandsYAESU UK LTD.Technical supplementmc格ame:CloseVERTEXSTANDARDHK LTD.Unit 5,20/F.,Seaview Centre,139-141 Hoi Bun Road,Kwun Tong,Kowloon,Hong KongC2007 VERTEX STANDARD CO.,LTD.VERTEX STANDARD(AUSTRALIA)PTY.,LTD.EHO31H90ANormanby Business Park,Unit 14/45 Normanby RoadNotting Hill 3168,Victoria,AustraliaContents49500IntroductionSpecificationsExploded ViewBlock DiagramConnection DiagramWIRE ASSY ListIntroductionAlignmentThis manual provides technical information neces-Board Unit (Schematics,Layouts Parts)sary for servicing the FT-950 HF/50 MHz Trans-MAIN Unitceiver.CNTL UnitServicing this equipment requires expertise in han-LOCAL Unitdling surface-mount chip components.Attempts bynon-qualified persons to service this equipmentPA-A Unitmay result in permanent damage not covered byTUNER Unitthe warranty,and may be illegal in some countries.DSP UnitTwo PCB layout diagrams are provided for eachSW-A Unitdouble-sided circuit board in the Transceiver.EachSW-B Unitside of is referred to by the type of the majority ofcomponents installed on that side("leaded"or"chip-VR-A Unitonly").In most cases one side has only chip com-VR-B Unitponents,and the other has either a mixture of bothPHONE Unitchip and leaded components(trimmers,coils,elec-MIC Unittrolytic capacitors,ICs,etc.),or leaded componentsKEY Unitonly.While we believe the technical information in thisDVS-6 Unit (Option)manual to be correct,VERTEX STANDARD as-sumes no liability for damage that may occur as aresult of typographical or other errors that may beDownloaded bypresent.Your cooperation in pointing out any in-RadioAmateur.EUconsistencies in the technical information would beappreciated.Important NoteThis transceiver was assembled using Pb (lead)free solder,based on the RoHS specification.Only lead-free solder(Alloy Composition:Sn-3.0Ag-0.5Cu)should be used for repairs performed on this apparatus.The solderstated above utilizes the alloy composition required for compliance with the lead-free specification,and any solder with theabove alloy composition may be used.